🏛 EU_PORTAL · 📍 EU
€5,000,000
Jul 7, 2026
Sep 16, 2026
Horizon Europe
Call with Digital Partnership and TTC countries
Expected Outcome:
The focus needs to be on areas where Digital Partnership countries bring strong complementary expertise, including advanced packaging, heterogeneous integration, and photonic chip technologies. The topic would aim to foster collaboration between European and Digital Partnership countries’ R&I communities. Projects are expected to contribute to the following outcomes:
• Innovative design and integration concepts for neuromorphic computing systems supporting very low energy consumption, connectivity, embedded functions for mobile applications.
• Alternative manufacturing process technologies for semiconductor chips including frontend or backend for heterogenous integration. The technologies should sustain in the mid- and long-term the fast-paced evolution of device performance, miniaturisation and cost, while reducing the environmental footprint.
• Very advanced packaging solutions aiming heterogeneous integration of multiple functions and materials for applications in communication (RF, mmW or THz), sensing, actuating, power management and active/passive integration.
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026.
Proposal page limits and layout: described in Part B of the Application Form available in the Submission System.
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026.
A number of non-EU/non-Associated Countries that are not automatically eligible for funding have made specific provisions for making funding available for their participants in Horizon Europe projects. See the information in the Horizon Europe Programme Guide.
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026 and in the Annex G of the Work Programme General Annexes.
Application form templates
Please use the application form that you will find in the Submission System. You can find examples of standard application forms in the Reference Documents page.
Guidance
Model Grant Agreements (MGA)
Call-specific instructions
Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026
For any questions related to this call please contact : Calls@chips-ju.europa.eu
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