🏛 EU_PORTAL · 📍 EU
€10,000,000
Jul 7, 2026
Sep 16, 2026
Horizon Europe
IA Resilience call reinforcing Europe's strength in photonics
Expected Outcome:
Proposals submitted to this call are expected to address several of the following elements:
• Scaling of wafer-level photonic processes for key materials (e.g. SiN, InP, GaAs),including process integration, yield optimisation, and manufacturability at highvolumes.
• Development of packaging and test solutions that are scalable, automated, andcompatible with co-packaged optics and advanced photonic-electronic integration.
• Integration of heterogeneous materials and components, such as on-chip lasers,modulators, and detectors, using advanced packaging and assembly approaches.
• Design-process-equipment co-optimisation, enabling repeatable, cost-effectiveproduction of complex photonic circuits and systems, including use of PDKs andvalidated building blocks.
• Demonstration of system-level functionality through application-relevant use casesin strategic sectors (e.g. AI, sensing, telecommunication, mobility, health, defence),with quantified performance metrics and clear market relevance.
Proposal page limits and layout: detailed in Part B of the Application Form, which you can access from the Call documents section on the Chips JU website's Call page
The following information are all described in the Appendix 7 of the Chips JU Workprogramme
Please visit the Chips JU website's Call page
Please refer to the calls documents section on the Chips JU website's Call page to view and download all required documents and templates.
2026 Guide for Applicants RIA_IA_FT-FPP
Evaluation Form Chips IA RIA FT-FPP
Template Application form Part B IA-RIA-FT FPP
Ownership Control Declaration form template
National Budgets Table template (xls)
Chips JU Multiannual Work Programme
Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026
PAB decision on the evaluation and selection procedures related to Calls for Proposals
ECS Strategic Research and Innovation Agenda
Annotated Model Grant Agreement for EU Funding Programmes 2021-2027
Model Grant Agreements (MGA)
Call-specific instructions
For help related to this call, please contact Calls@chips-ju.europa.eu
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