Quantum Experimental Pilot Lines for Quantum Technologies

Expected Outcome:

This action will strengthen Europe's leadership and strategic autonomy in quantum technologies by advancing experimental pilot line capacities as a vital stepping stone toward future industrial-scale quantum hardware production. Qu-Pilot serves as the critical intermediary between academic research and the stable pilot lines under the Chips Joint Undertaking, offering a testbed for technological innovation, reproducibility, and manufacturability.

Expected outcomes include:

• Deployment of experimental quantum pilot lines addressing diverse platforms and materials, laying the groundwork for broader integration into Chips JU pilot lines.
• Establishment of scalable and reproducible quantum fabrication processes, advancing TRL 4–6 technologies and addressing early-stage certification, standardisation, and quality control.
• Reinforcement of a pan-European quantum hardware ecosystem through shared infrastructure and open-access models, fostering participation from SMEs, startups, and research institutes.
• Demonstrated ability to accelerate technology maturity and feed critical feedback loops into future Chips JU stability pilot lines.
• Enhanced synergies with testing infrastructures (e.g., Qu-Test), standardisation efforts, and industrialisation roadmaps, enabling horizontal integration across computing, communication, sensing, and enabling tech domains.

Scope:

The action is to implement the pilot production elements of the Qu-Pilot Framework Partnership Agreement. The proposal should advance the maturity of quantum hardware technologies in alignment with EU industrial strategy, emphasising flexibility, innovation, and scalability.

The proposal should address:

• Establishment or enhancement of experimental pilot production infrastructure for TRL 4–6 quantum hardware technologies, with strong R&D orientation.
• Development of pre-industrial processes for:
  • Quantum processors (e.g., superconducting, trapped ions, photonic),
  • Quantum sensors (e.g., NV centers),
  • Cryo-compatible packaging and interconnects.
• Integration of cleanroom capabilities with lithography, etching, and deposition tailored to quantum device requirements (e.g., silicon, diamond, III-Vs), ensuring convergence with Chips JU standards.
• Creation of collaborative fabrication access models (shared-cost basis) open to academic and industrial partners.
• Development of standardised workflows for yield analysis, reproducibility, and quality assurance, supporting component certification pathways.
• Continuous engagement with Qu-Test and other testbeds to enable rapid iteration cycles and technology validation.
• Active alignment with Chips JU’s pilot line roadmap to enable seamless transfer of validated technologies once the stability pilot lines are operational.
• Contribution to a transversal European infrastructure serving multiple quantum domains (computing, sensing, communications), ensuring cross-domain integration and maximising synergies.

Technology Readiness Level - Technology readiness level expected from completed projects